LG G6 disassembly: Heat pipe cooling suppresses Snapdragon 821

LG G6 disassembly: Heat pipe cooling suppresses Snapdragon 821
LG officially released its new phone LG G6. LG G6 is equipped with Snapdragon 821 processor, built-in 4GB memory, provides dual 13-megapixel rear cameras and 5-megapixel front cameras, 3300mAh battery capacity, and supports QC 3.0 fast charging. It uses a 5.7-inch 2880*1440 resolution display with an 18:9 ratio and rounded corner cutting technology on the edges. After presenting the real machine pictures, foreign media quickly brought the disassembly of LG G6. If you are interested, you may want to take a look. As an international manufacturer, the workmanship and materials of LG G6 are naturally beyond reproach. Foreign media found that LG G6 actually uses heat pipe cooling technology, which makes the treatment of this Snapdragon 821 almost the same as that of Snapdragon 810. Perhaps it was stimulated by Note 7...

As a winner of Toutiao's Qingyun Plan and Baijiahao's Bai+ Plan, the 2019 Baidu Digital Author of the Year, the Baijiahao's Most Popular Author in the Technology Field, the 2019 Sogou Technology and Culture Author, and the 2021 Baijiahao Quarterly Influential Creator, he has won many awards, including the 2013 Sohu Best Industry Media Person, the 2015 China New Media Entrepreneurship Competition Beijing Third Place, the 2015 Guangmang Experience Award, the 2015 China New Media Entrepreneurship Competition Finals Third Place, and the 2018 Baidu Dynamic Annual Powerful Celebrity.

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