New nanotechnology could make circuit boards as thin as paper

According to foreign media reports, Oregon State University in the United States has developed a new type of nanotechnology that can achieve lossless fusion of complex materials, thereby producing circuit boards as thin as paper. Nanoparticle fusion technology is not new, but due to excessive reliance on high temperatures during the embedding process, it often causes huge damage during the process, affecting the production process. The new technology will use photon technology and use xenon lamps instead of traditional heat sources for fusion operations, which is 10 times more efficient than before, thereby reducing the loss of long-term high-temperature fusion.

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Simply put, if this technology has market prospects, we can expect the size of mobile phones, tablets, and computers to be further reduced in the future, which is exciting.