Comparative Analysis of Apple Mobile Phone Disassembly and Schematic Diagram (Design Specifications)

Smartphones should reflect the highest technological achievements of modern precision manufacturing and electronic chip industries. In the past few years, I have had experience in the research and development of mobile phones and tablets. Although the design of mobile phones is very complicated and my own research is not in-depth, this article can be used as a starting point for introduction. In addition, I have also disassembled many Apple mobile phones and iPads. There are a lot of mobile phone disassembly documents. This article tries to understand this craft from the technical level of disassembly combined with schematic layout and other aspects, and try to give you some inspiration on hardware design from another perspective.

This article mainly takes the newer iPhone 6 and iPhone 6s as examples. Because there are more reference materials, the schematics that can be found are relatively old, mainly iPhone 4s and iPhone 5, but it does not affect learning. The figure below is the component distribution diagram of the front of iPhone 6, where you can clearly see the main components and function introductions. The front includes common CPU and SIM card holder, baseband CPU, camera, power amplifier chip and commonly used interfaces and other modules.

The corresponding point map is relatively small, so please bear with me and take a look at it. You can basically see that the overall layout is quite compact.

Compared with the schematic diagram, I have to say that Apple's schematic diagram is still very detailed, clear and intuitive. In addition to the page title description of each unit module and strapping information that is essential for our design, the power signal is also bolded to facilitate debugging and collaborative design. In addition, the entire design document is very clear, and the document lists the materials that can be replaced, and the bom variant is also very detailed. Therefore, this drawing has as many as 51 pages. 1. The power signal is bolded to facilitate layout engineers

2. Page title function module introduction information.

3. Information on alternative materials.

4. Memory configuration information is clear and detailed

5. The schematic diagram is well detailed, the overall design is very beautiful, the icons are aligned, and the differences are clear. I have seen many schematic diagrams of customers, and I often feel very uncomfortable and there is no aesthetic feeling at all.

6. The device information is very complete, even the temperature coefficient information and material of the capacitor are marked

7. Corresponding PCB board chip model and supplier analysis.

Red: A8 processor, code number APL1011 Orange: Qualcomm MDM9625M baseband chip, full network access depends on it Yellow: Skyworks' 77802-23 Low Band LTE PAD Green: Avago's A8020 KA1428 JR159 (High Band PAD) Blue: Avago A8010 KA1422 JNO27 Pink: TriQuint TQF6410 1425 KORE ATO315

Apple A7 APL0698 SoC Qualcomm MDM9615M LTE module Qualcomm WTR1605L LTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS receiver